GE Intelligent Platforms has announced the bCOM6-L1200 Rugged Type 6 COM Express Module.
According to the company, the bCOM6-L1200 is ideal for OEMs designing computing platforms into equipment for industrial or harsh environments, who need to reduce the overall design cycle and lower validation costs.
By separating the carrier card from the processor, the bCOM6-L1200’s COM Express architecture extends the useful life of the subsystem by allowing simple, cost-effective upgrade of the processor alone.
The manufacturer says it selected the on-board components for their reliability in demanding conditions. The processor and memory are soldered to the board to resist shock and vibration.
Extended mechanical construction protects the module, which is designed for optional conformal coating for even greater resistance to moisture, dust, chemicals, and temperature extremes.