AGILENT Technologies has announced the latest release of the Integrated Circuit Characterisation and Analysis Program.
The 2011.04 release of IC-CAP device modelling software platform provides significant improvements in the modelling flow of semiconductor devices. The IC-CAP Wafer Professional automated measurement solution can now link with the CMOS model extraction packages.
Modern CMOS device modelling requires that a high volume of measurements be performed to analyse process trends and identify data required for extraction of typical and corner-case device models.
Managing and analysing this data to ensure the right choices are made for model extraction and verification is challenging, requiring engineers to use multiple tools and convert between various formats.
IC-CAP WaferPro helps the user to collect and manage high volume data efficiently. Now, IC-CAP CMOS modeling packages work seamlessly with WaferPro.
With IC-CAP 2011.04, users are able to define devices and measurement tests in the Agilent CMOS Package environment and then automatically create a WaferPro test plan that they can execute on a variety of test equipment.
Once the devices of various geometries have been characterized via WaferPro, the CMOS extraction module automatically reads the measurement data for use in model extraction. There is no need to transfer or reformat data between the measurement and modelling applications.
In addition to the WaferPro and CMOS packages link, IC-CAP 2011.04 adds support for Windows 7 and several platform improvements.