Brisbane-based contract manufacturer Crystalaid says it has acquired a die and wire bonder. According to the company, the equipment, from FEK Delvotec, will provide manufacturing capabilities covering a complete range of die and wire bonding applications including eutectic die attachment, Chip-On-Board (COB), Chip-On-Chip and Flip Chip Assembly.
“Currently Australian organisations outsourcing electronics manufacturing have little choice but to send components requiring die and wire bonding services overseas,” explains Crystalaid’s business manager, Gerald Parker.
“This service will benefit organisations undertaking prototyping of new products as they will now be able to have samples made in Australia at significantly reduced costs with faster response times.”
Wire bonding uses gold or aluminium wire, between 15 to 75 µm diameter, to connect the silicon directly to a PCB or ceramic substrate eliminating the need for conventional packaging.
“The introduction of this equipment adds a new dimension to electronics contract manufacturing in Australia,” claims Frank Faller, the company’s operations manager.