- Clipsal extends Iconic range
- Australia’s acoustic sensors market set for solid growth
- Energy storage specialist opens Australian office
- Firmware upgrade for measurement amplifiers
Nordson EFD has released a new guide, “Nordson EFD Solutions: Fluid Positioning & Precision Dispensing in Mobile Device and Wearables Manufacturing.” It features the dispensing solutions available to help manufacturers meet growing consumer demand for thinner, lighter, and more sophisticated, yet durable electronic devices.
The guide covers a number of applications common to the industry, including:
- Display applications such as bonding cover glass to LCDs and OLEDs
- Optical bonding and seal bonding with anisotropic conductive fluids
- Camera module applications such as frame bonding and IR cut filter bonding
- Microspeaker applications such as membrane bonding
- Hydrophobic coating during final assembly
- Conformal coating microchip leads and printed circuit boards (PCBs)
- Soldering RF shields onto MEMS microphones with dispensable solder paste
- Applying thermal compound to heat sinks for central processing units (CPUs)
Nordson EFD provides dispensing solutions ranging from needle valves that dispense micro-deposits as small as 0.15 mm in diameter to jet valves that meet tight tolerances in terms of precise, repeatable deposit volumes, dimensions, and patterns at speeds up to 1000Hz continuous.
When paired with EFD’s automated dispensing robots, which combine proprietary dispensing software with fully integrated vision systems and up to +/- 0.004 mm positional repeatability, it is possible to optimise production processes, claims the company.