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GaN Systems claims it has experienced a surge in the number of customers designing and deploying power systems using their GaN transistors.
By using GaN transistors instead of silicon components; customers are gaining a competitive advantage as they enter the market with 50W to 50kW power systems that are up to 5X smaller and 3X lighter.
To support customers who are modeling new systems using SPICE simulations, GaN Systems has released individual computer models for each of their products as well as a new application note, GN007, “Modeling Thermal Behavior of GaN Systems’ GaNPX Using RC Thermal SPICE Model”.
GaN Systems’ transistors are built in a feature-rich GaNPX package that is designed for extreme speed and current. The low profile GaNPX package has high power dissipation and low inductance which are said to enable fast, MHz power switching. Customers can verify the package’s optimal thermal performance by using the GN007 SPICE model protocol.
“Our customers are constantly pushing on design limits that only our GaN can enable,” states Larry Spaziani, VP of Sales and Marketing, GaN Systems. “We’ve invested in expert thermal simulations that use state-of-the-art finite element analysis tools to model our best-in-class power devices. The models have been converted into easy-to-use SPICE models and have been verified both in multiple simulation environments and in the test laboratory.”