semiconductor

Analogix Semiconductor and Beijing Shanhai Capital Management have jointly announced the completion of the approximately US$500 million acquisition of Analogix Semiconductor. China Integrated Circuit Industry Investment Fund joined Shanhai Capital’s fund as one of the limited partners. “We are very pleased to have completed the transaction,” said Kewei Yang, Analogix Semiconductor’s chairman and CEO. “Enhanced … Continue reading Analogix Semiconductor welcomes new investors →

After our recent article that Canon had passed on investing in Toshiba’s troubled memory chip business, news has come via the Financial Times that a few other well-known investors are putting up their hands for a slice of the pie. The company is said to have had bids from Taiwan’s Foxconn, who manufacture Apple’s iPhone … Continue reading Suitors scramble for piece of Toshiba memory chip pie →

Panasonic Semiconductor Solutions (PSCS) and United Microelectronics Corporation (UMC) have reached an agreement to jointly develop next-generation 40nm Resistive Random Access Memory (ReRAM) technology for mass production. ReRAM, similar to mainstream flash memory, is a type of non-volatile memory that features a simple structure, high-speed processing and low power consumption. Panasonic first entered mass production … Continue reading Panasonic and UMC sign ReRAM agreement →

Research and Markets’ Home Entertainment Devices Market Report, forecasts that the global market is expected to reach almost $295 billion by 2022, which is good news for those who manufacture and supply components to the CE sector. Video devices are estimated to be the most dominant product type in the market from 2015 to 2022. … Continue reading Good news for component suppliers on home entertainment front →

With a massive recall of its Samsung Galaxy Note 7 last year you would think that the Korean tech giant couldn’t wait to see the back of 2016. Luckily for Samsung, and its shareholders, it doesn’t have to rely on its consumer electronics division to turn a profit. While the company took a hit of … Continue reading Samsung’s components cover Galaxy 7 disaster →

STMicroelectronics has delivered one million development kits for its STM32 microcontrollers and 100,000 kits for the STM8 family, equipping product designers all over the world to create tiny smart devices. Each development kit jump-starts product designs to assist faster delivery into markets that can range from a few hundred units to millions of units, and … Continue reading Microcontrollers drive the smart revolution →

Mitsubishi Electric will present a hands-on mini lab showcasing its high-efficiency, wide-band Doherty Amplifier at their booth at Radio & Wireless Week, Jan. 16-17, 2017 at the Hyatt Regency, Phoenix, Arizona. The company will also present a technical paper describing this wide-band Doherty power amplifier design technique for next generation LTE base stations using the … Continue reading Compact design of amplifier improves efficiency →

Toshiba has announced the launch of a new line-up of low-capacitance TVS diodes for use in high-speed interfaces in mobile devices, including smartphones, tablet PCs and wearable devices. The line-up covers ten products to protect high-speed interfaces, including USB 3.0/3.1 and HDMI, from electronic discharge (ESD) and noise. Shipments start from today. The new series offers … Continue reading TVS diodes for smartphones and other mobile devices →

Smartmatic has released research highlighting voters’ concerns over the current state of America’s voting machines and underlining the connection between outdated technology and a lack of trust in U.S. voting systems. Conducted by the global insight and analytics consultancy Edelman Intelligence, the findings show that following a contentious presidential election, the majority of 2016 U.S. … Continue reading Concern about technology in U.S. voting system →

Congatec is introducing new Server-on-Modules with Intel Xeon D processors (Broadwell) parallel to the preview release of the COM Express Type 7 specification. Based on the COM Express Basic standard form factor (95 x 125 mm), the modules feature 10 Gigabit Ethernet interfaces, 32 PCIe lanes and headless server performance currently with up to 16 … Continue reading New Server-on-Modules make debut →

Panasonic’s KX-TGM420 Series is a home phone solution designed for improved communications for anyone affected by hearing loss. It has a voice volume up to 40 decibels (dB) to make caller voices easier to hear, while the base unit can be set to ring loudly at up to 112 dB. The ‘Slow Talk’ feature slows … Continue reading Cordless phone for hearing impaired →

Power management company Eaton has launched an Australian developed wall mount power system for oil and gas, mining, and transportation industries that require battery backed DC power. The system is also suitable for industrial control, electrical switching and telecommunications industries as well any business that designs and manufactures large turnkey process control systems. Traditionally, DC … Continue reading Aussie developed mount power system →

It is the double helix, with its stable and flexible structure of genetic information, that made life on Earth possible in the first place. Now a team from the Technical University of Munich (TUM) has discovered a double helix structure in an inorganic material. The material comprising tin, iodine and phosphorus is a semiconductor with … Continue reading Flexible semiconductor for electronics →

Backplane Systems has released the Neousys Technology Nuvo-6000 Series, a Fanless Box PC based on latest Intel 6th-Gen Skylake platform. It features up to five PCIe/PCI slots to provide the same level of expandability as traditional Industrial Computers, while its fanless design offers superior reliability. Powered by the Intel 6th-Gen LGA1151 socket-type CPU, the Nuvo-6000 … Continue reading New fanless PC →

STMicroelectronics and Securitag Assembly Group (SAG), a leading supplier of RFID transponders have announced a tiny NFC Ferrite Tag that uses STMicroelectronics’ ST25 NFC tag IC for IoT (Internet of Things) data-transmission applications. Small, light, and thin, the NFC Ferrite Tag can be surface-mounted during production through the metal pad that can be directly soldered … Continue reading STMicroelectronics and SAG combine to deliver high-performance NFC Tags for IoT →

The µsprint hp-opc 3000 is specially designed for the requirements of wafer test locations with a variety of different probe cards as well as large-volume throughput. Probe cards are special test devices that are used for standard function tests of wafers at the end of the so-called front-end process. This means, they are used after … Continue reading New inspection system for semiconductors industry →

LED manufacturer Lumileds and low-temperature RPCVD innovator BluGlass will collaborate to create enhanced LEDs for certain applications.

THE SEMICONDUCTOR Industry Association (SIA) says global semiconductor sales have slowed during the first few months of 2016.

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and the world’s largest supplier of short- and mid-range (24GHz) radar chips for Advanced Driver Assistance Systems (ADAS), is now supplying its latest long-range (77GHz) radar chips to leading automotive customers.

CISCO Systems is acquiring Israel-based Leaba Semiconductor, a fabless semiconductor company which designs chips for connecting memory, storage and computing in data centres.