SAMSUNG Electronics and Micron Technology have announced a consortium for OEMs, enabler and integrators to collaborate on the Hybrid Memory Cube (HMC) technology.
The Hybrid Memory Cube Consortium (HMCC) will work closely with fellow developers Altera, Opoen Silicon and Xilinx to accelerate industry efforts to develop and implement an open interface specification for the new memory technology.
The consortium will initially define a specification to enable applications ranging from large-scale networking to industrial products and high-performance computing.
According to Samsung and Micron, the industry is being challenged because the memory bandwidth required by high-performance computers and next-generation networking equipment has increased beyond what conventional memory architectures can provide.
This so-called “memory wall” can only be solved via a new architecture which will provide increased density and bandwidth at significantly reduced power consumption, which HMC promises to deliver.
Proponents of the technology say it provides a paradigm shift in performance, packaging and design efficiencies. Defining an industry interface specification is the first step to making HMC a successful new high-performance memory option.
HMC could lead to unprecedented levels of memory performance and facilitate new applications in networking, medical, energy, wireless communications, transportation, security and other markets.
For example, the development of systems and technologies will enable a more efficient, reliable and secure smart grid infrastructure with integrated renewable energy resources.