IBM’s 45nm SOI microprocessors at core of Nintendo Wii U


IBM says its microprocessors will be at the core of the just-announced Nintendo Wii U gaming system.

The Wii U gaming console was unveiled at the E3 trade show. It will be available to consumers in 2012. It features a controller with an integrated touchscreen.

IBM says Nintendo’s latest console will be powered by its new Power Architecture-based microprocessor, which includes its latest technology in an energy-saving silicon package.

The microprocessor will utilise IBM’s embedded DRAM, which is capable of feeding the multi-core processor large chunks of data to make for a smooth entertainment experience.

Millions of the chips will be produced for Nintendo. These will feature IBM Silicon on Insulator (SOI) technology at 45nm. The custom-designed chips will be made at IBM’s 300mm semiconductor development and manufacturing facility in East Fishkill, New York.

The relationship between IBM and Nintendo dates to May 1999, when IBM was selected to design and manufacture the central microprocessor for the Nintendo GameCube™ system. Since 2006, IBM has shipped more than 90 million chips for Nintendo Wii systems.